Specifications for: Delta WASP 40100 Clay
- Technology Fused Filament Fabrication (FFF)
- Extruders LDM WASP Extruder 3.0
- Interface SD Card – LCD Screen
- Build volume Ø 200 mm x h 400 mm
- Layer height Min. 0,5mm
- View all specifications
- Printing speed Max 150 mm/s
- Nozzle temperature 20-30 C°
- Platform temperature nvt
- Supported filament Clay
- Nozzle diameter 1,5 - 2 -3mm
- Filament diameter
- Connectivity SD card
- Software Compatible with all slicing-software (Cura - Slic3r - Simplify3D®)
- Supported fileformat .stl, .obj, .gcode
- Size 44 cm x 49 cm x h 87 cm
- Supported Operating System WINDOWS/ IOS/ LINUX
- Weight 40kg
