Specifications for: Raise3D E2 - Insole Package
- Technology Fused Filament Fabrication (FFF)
- Extruders Dual extruder (IDEX)
- Interface 7 inch full color touch screen
- Build volume 330 x 240 x 240mm
- Layer height 0.01 mm ~ 0.25 mm
- View all specifications
- Printing speed 30 ~ 150 mm/s
- Nozzle temperature max 300 ºC
- Platform temperature max 110ºC
- Supported filament NNylon, PLA, ABS, HDPLA, PC, TPU 95A, PP, PVA, PETG, Filled, PLA, Filled Nylon
- Nozzle diameter 0.2/ 0.4/ 0.6/ 0.8mm
- Filament diameter 1.75 mm
- Connectivity USB 2.0, WIFI, LAN
- Software ideaMaker
- Supported fileformat STL, OBJ
- Size 607 × 596 × 465 mm
- Supported Operating System WINDOWS/ IOS/ LINUX
- Weight na
